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HS-508BRH
Data Sheet August 11, 2009 FN4824.2
Radiation Hardened 8 Channel CMOS Analog Multiplexer with Overvoltage Protection
The HS-508BRH is a dielectrically isolated, radiation hardened, CMOS analog multiplexer incorporating an important feature; it withstands analog input voltages much greater than the supplies. This is essential in any system where the analog inputs originate outside the equipment. They can withstand a continuous input up to 10V greater than either supply, which eliminates the possibility of damage when supplies are off, but input signals are present. Equally important, it can withstand brief input transient spikes of several hundred volts; which otherwise would require complex external protection networks. Necessarily, ON resistance is somewhat higher than similar unprotected devices, but very low leakage current combine to produce low errors. Reference Application Notes 520 and 521 for further information on the HS-508BRH multiplexer in general. The HS-508BRH has been specifically designed to meet exposure to radiation environments. Operation from -55C to +125C is guaranteed.
Features
* Electrically Screened to SMD # 5962-96742 * QML Qualified per MIL-PRF-38535 Requirements * Radiation Environment - Gamma Dose () . . . . . . . . . . . . . . . . . 3 x 105 Rad (Si) - Dielectrically Isolated Device Islands - SEP >100 Mev-mg/cm2 * Analog/Digital Overvoltage Protection * ESD Rated to 3kV * Fail Safe with Power Loss (No Latchup) * Break-Before-Make Switching * (Typ) DTL/TTL and CMOS Compatible Threshold * Analog Signal Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V * Fast Access Time * Supply Current at 1MHz Address Toggle . . . . . .4mA (Typ) * Standby Power . . . . . . . . . . . . . . . . . . . . . . . .7.5mW (Typ) * Pb-Free (RoHS Compliant) Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-96742. A "hot-link" is provided on our homepage for downloading. www.intersil.com/spacedefense/newsafclasst.asp
Ordering Information
ORDERING NUMBER (Note) 5962F9674202QEC 5962F9674202QXC 5962F9674202VEC 5962F9674202VXC HS1-508BRH/PROTO HS9-508BRH/PROTO INTERNAL MKT. NUMBER HS1-508BRH-8 HS9-508BRH-8 HS1-508BRH-Q HS9-508BRH-Q HS1-508BRH/PROTO HS9-508BRH/PROTO PART MARKING Q 5962F96 74202QEC Q 5962F96 74202QXC Q 5962F96 74202VEC Q 5962F96 74202VXC HS1- 508BRH /PROTO HS9- 508BRH /PROTO TEMP. RANGE (C) -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 PACKAGE (Pb-Free) 16 Ld SBDIP 16 Ld FLATPACK 16 Ld SBDIP 16 Ld FLATPACK 16 Ld SBDIP 16 Ld FLATPACK PKG. DWG. D16.3 K16.A D16.3 K16.A D16.3 K16.A
NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2001, 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners
HS-508BRH Pinouts
HS-508BRH (16 LD SIDEBRAZE DIP) MIL-STD-1835, CDIP2-T16 TOP VIEW
AO 1 EN 2 -VSUP 3 IN 1 4 IN 2 5 IN 3 6 IN 4 7 OUT 8 16 A1 15 A2 14 GND 13 +VSUP 12 IN 5 11 IN 6 10 IN 7 9 IN 8 A0 EN -VSUP IN1 IN2 IN3 IN4 OUT
HS9-508BRH (16 LD FLATPACK) MIL-STD-1835, CDFP4-F16 TOP VIEW
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 A1 A2 GND +VSUP IN5 IN6 IN7 IN8
Functional Diagram
A0 1 DIGITAL ADDRESS P IN 1 N
A1 OUT
A2
8 EN P ADDRESS INPUT BUFFER AND LEVEL SHIFTER DECODERS N IN 8
MULTIPLEX SWITCHES
TABLE 1. TRUTH TABLE A2 X L L L L H H H H A1 X L L H H L L H H A0 X L H L H L H L H EN L H H H H H H H H "ON" CHANNEL NONE 1 2 3 4 5 6 7 8
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FN4824.2 August 11, 2009
HS-508BRH Die Characteristics
DIE DIMENSIONS 120 mils x 93 mils x 19 mils INTERFACE MATERIALS Glassivation Type: Phosphorus Silicon Glass (PSG) Thickness: 8kA 1kA Top Metallization Type: AlSiCu Thickness: 16kA 2kA Substrate Rad Hard Silicon Gate Dielectric Isolation Worst Case Current Density 6.68e04 A/cm2 Transistor Count 506 Backside Finish Silicon ASSEMBLY RELATED INFORMATION Substrate Potential Unbiased (DI) ADDITIONAL INFORMATION
Metallization Mask Layout
HS-508BRH
IN2 (5) IN1 (4) -V (3)
IN3 (6) EN (2)
IN4 (7) OUT (8)
A0 (1)
IN8 (9)
A1 (16)
IN7 (10)
A2 (15)
IN6 (11) IN5 (12) +V (13) GND (14)
TABLE 2. HS-508BRH PAD COORDINATES RELATIVE TO PIN 1 PIN NUMBER 1 2 3 4 5 6 7 8 PAD NAME A0 EN VIN1 IN2 IN3 IN4 OUT X COORDINATES 0 -342 -818 -818 -818 -598 -224 -38 Y COORDINATES 0 0 -653 -879 -1221 -2579 -2579 -2579
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FN4824.2 August 11, 2009
HS-508BRH
TABLE 2. HS-508BRH PAD COORDINATES (Continued) RELATIVE TO PIN 1 PIN NUMBER 9 10 11 12 13 14 15 16 NOTE: Dimensions in microns PAD NAME IN8 IN7 IN6 -IN5 V+ GND A2 A1 X COORDINATES 314 724 1066 1066 1100 1038 684 342 Y COORDINATES -2579 -2579 -2579 -761 -287 0 0 0
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 4
FN4824.2 August 11, 2009

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